Sheet cutting device and cutting method

ABSTRACT

A cutting device  15  that, after a sheet S is stuck on a wafer W on a sticking table  13 , cuts the sheet S along the outer edge of the wafer. The cutting device  15  comprises a robot body  62  disposed beside the sticking table  13  and a cutter blade  63  supported by a tool holding chuck  69  positioned at the front end of the robot body  62 . The cutter blade  63  is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet S in a state that the posture thereof is adjusted along a preset movement track.

FIELD OF THE INVENTION

The present invention relates to a sheet cutting device and a cuttingmethod, particularly to a sheet cutting device and a cutting methodcapable of cutting a sheet along a preset track and performing thecutting of the sheet with high precision.

BACKGROUND OF THE ART

Conventionally, semiconductor wafers (hereinafter, simply referred to as“wafer”) are stuck with a protective sheet for protecting circuitsurface thereof, and stuck with a heat sensitive adhesive sheet on therear surface or front surface thereof.

As a sheet sticking method described above, the following methods areknown. That is, using a raw strip sheet in which plane-shape sheetscorresponding to the shape of the wafer are temporarily stuck on arelease liner, the sheet is peeled off from the release liner with apeel plate, and then stuck onto the wafer; or using a raw strip sheet inwhich a strip of sheet is temporarily stuck on a strip of release liner,the sheet is peeled off from the release liner, stuck onto a wafer, andthen cut off along the periphery of the wafer, thus the sheet is stuckonto the wafer (refer to, for example, patent document 1).

Patent document 1: Japanese Patent No. 2919938

SUMMARY OF THE INVENTION Problem to be Solved by the Invention

However, in the method of sticking plane-shape sheets corresponding tothe shape of the wafer, there is such a disadvantage that a precisesheet feed-out structure and a table shifting mechanism areindispensable for precisely matching the outer periphery of the waferand the outer periphery of the sheet.

Also, the cutting device in the sticking apparatus disclosed in thepatent document 1 is disposed immediately above the sticking table forsupporting the wafer, and the sticking apparatus is arranged to beobliged to use such the cutting device, the rotation center of which ison a straight line running through the center of the wafer. Therefore,there is such a disadvantage that an extremely precise alignment betweenthe rotation center of the cutting device and the rotation center of thewafer is required. Furthermore, the cutting direction is to becircumferential direction along the periphery of the wafer, and therebythe cutting device is not adapted to the cutting operation of otherplane shapes, for example, the cutting in the direction along the outerperiphery of a polygon shape; thus, resulting in a poor versatility as acutting device.

Moreover, every alteration of the wafer size requires an adjustment ofthe cutter position, and since the cutter of the cutting device is keptin a constant posture, it is not possible to adjust the posture of acutter blade corresponding to the thickness of the sheet or thesectional shape of the outer periphery of an adherend or the like. Evenif the case where the posture can be adjusted, there still residesanother disadvantage that a deviation of cutting diameter due to thealteration of the posture has to be adjusted again.

Still further, since the cutting device is positioned above the wafer,there is such a disadvantage as well that, when a failure occurs on thedevice, the cutter blade may accidentally touch a hand of a worker whilecarrying out removal operation of the wafer or maintenance operation,resulting in an injury.

OBJECT OF THE INVENTION

The present invention has been proposed in view of the abovedisadvantages. It is an object of the present invention to provide asheet cutting device and a cutting method capable of adjusting theposture of a cutter in cutting operation, and even when cutting positionis changed accompanying the adjusting of the posture of the cutter, thecutting diameter can be maintained precisely to a preset value; moreoverthe cutting operation can be carried out without restriction of cuttingshape.

Means for Solving Problems

In order to achieve the above object, the present invention adopts suchan arrangement that a sheet cutting device to cut a sheet stuck on anadherend on a sticking table, comprising: a robot body and a cutterblade supported on a free-end of the robot body, wherein

the robot body is a multi-joint robot having a plurality of joints andthese joints are controlled based on numerical information.

Also, the present invention adopts such an arrangement that a sheetcutting device to cut a sheet stuck on an adherend on a sticking table,comprising: a robot body disposed beside the sticking table and a cutterblade supported on a free-end of the robot body and arranged so as tomove along a preset track, wherein

the robot body includes a tool holding chuck on the free-end side, andthe cutter blade is detachably attached thereto via the tool holdingchuck.

Further, the cutter blade may built-in a heater therein.

Furthermore, the cutter blade may be arranged so as to vibrate via avibrating device.

Still further, such an arrangement is adopted that the robot bodysupports the cutter blade so as to adjust the posture of the cutterblade when cutting the sheet along the outer periphery of the adherend.

In the present invention, such an arrangement may be adopted that aposture of the cutter blade in the sheet cutting operation maintains atoe-in angle with which the center line of the cutter blade is inclinedwith respect to the cutting direction viewed from the top in the cuttingdirection, and a blade edge of the cutter blade is positioned closer tothe outer periphery of the adherend than the back portion of the cutterblade.

Also, the posture of the cutter blade in the sheet cutting operation maybe arranged so as to maintain a camber angle with which the center lineof the cutter blade is inclined viewed from the front in the cuttingdirection, and the sheet can also be cut with no protrusion out of theouter periphery of the adherend.

Further, such an arrangement may be adopted that the posture of thecutter blade in the sheet cutting operation maintains a caster anglewith which the center line of the cutter blade is inclined in thecutting direction viewed from the side in the cutting direction, and theangle formed between the sheet and the blade edge is kept at an acuteangle.

Furthermore, such an arrangement is adopted that an inspection means forinspecting cutter blades is disposed in the vicinity of the robot body.

The present invention adopts such a sheet cutting method to cut a sheetstuck on an adherend on a sticking table that

a multi-joint robot body is used, the robot having a plurality of jointscontrolled based on numerical information and holding a cutter blade ona free-end of the robot body in a state enabling to adjust a posture ofthe cutter blade, and

the sheet is cut by movement of the cutter blade along a preset track.

Also, the present invention adopts such a sheet cutting method to cut asheet stuck on an adherend on a sticking table, wherein

a cutting device is used, a robot body of which is disposed beside thesticking table and holds a cutter blade on a free end thereof in a stateenabling to adjust a posture of the cutter blade, and

the cutting device includes a cutter blade and the sheet is cut bymovement of the cutter blade along a preset track.

In the above cutting method, the sheet may be cut in a state that thecutter blade is heated.

Also, the cutter blade may also cut the sheet while being vibrated.

Further, such a method is adopted that the cutter blade maintains atoe-in angle with which the center line of the cutter blade is inclinedwith respect to the cutting direction viewed from the top in the cuttingdirection, and the sheet is cut in a state that a blade edge of thecutter blade is positioned closer to the outer periphery of the adherendthan the back portion of the cutter blade.

Furthermore, such a method may also be adopted that the cutter blademaintains a camber angle with which the center line of the cutter bladeis inclined viewed from the front in the cutting direction, and thesheet is cut with no protrusion out of the outer periphery of theadherend.

Still further, such a method may be adopted the cutter blade maintains acaster angle with which the center line of the cutter blade is inclinedin the cutting direction viewed from the side in the cutting direction,and the sheet is cut while keeping the angle formed between the sheetand the blade edge at an acute angle.

It is possible to adopt such a method that the sheet is an adhesivesheet temporarily stuck on a strip of release liner as an adherend viaan adhesive, and the adhesive sheet and adhesive are cut without cuttingthe release liner.

Further, such a method may be adopted that the sheet is an adhesivesheet temporarily stuck on a strip of release liner as an adherend viaan adhesive, and

a partial cutting is made to form a cutoff line without completelycutting the release liner and/or adhesive sheet.

EFFECT OF THE INVENTION

According to the present invention, since the robot body is controlledin a manner of NC (Numerical Control), the movement amount of therespective joints with respect to a workpiece is controlled based on thecorresponding numerical information respectively, and each movementamount is controlled through a program. Therefore, being different fromthe conventional cutting means, the position of the cutter blade doesnot have to be changed manually whenever the wafer size is altered.Also, in the conventional cutting means, deviation of cutting diametercaused by the alteration of the posture of the cutter blade had to beadjusted every time of the alterations. The robot body of the presentinvention can maintain the cutting diameter precisely to a preset valueno matter how the posture of the cutter blade is changed. Further,during non-cutting operation, since the cutter blade can be escaped to aposition out of an area above the table; i.e., to an area beside thetable, a wide workspace can be ensured above the sticking table, andsuch a risk can be reduced that a worker accidentally touches the cutterblade while removing an adherend from the sticking table manually orcarrying out maintenance services.

Furthermore, since the cutter blade is detachably attached via the toolholding chuck, the cutter blade can be replaced easily and swiftly.

Still further, according to such an arrangement that the cutter bladeincorporates the heater therein, the adhesive sheet can be cut moreeasily.

Still furthermore, owing to such an arrangement that the cutter bladecuts the adhesive sheet while vibrating via the vibrating device, thecutting performance can be enhanced.

Further, since the cutter blade is capable to adjust its posture bycontrolling the joints of the robot, the cutting angle can be alteredcorresponding to the stiffness and thickness of the sheet, the sectionalconfiguration of the outer periphery of the adherend and the like; thuscutting operation can be achieved in accordance with the purpose.

For example, in a state that the cutter blade maintains the toe-inangle, cutting of the sheet just to fit to the outer periphery positionof the adherend can be achieved.

Furthermore, in a state that the cutter blade maintains the camberangle, when the outer edge of the adherend is chamfered, the sheet canbe cut with no protrusion out of the outer periphery of the adherend.

Still further, in such a state that the cutter blade maintains a casterangle, by inclining the blade end corresponding to the stiffness andthickness of the sheet, the sheet cutting force can be reduced.

Further, owing to such an arrangement that an inspection means of thecutter blade is disposed along with the cutting device, defects of theblade edge and adhering degree of adhesive of the sheet on the bladeedge can be automatically detected. Owing to this, the cutter blade canbe replaced with a new one, and thus, satisfactory cutting performancecan be maintained stably.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front view schematically showing a sheet sticking apparatusin accordance with an embodiment.

FIG. 2 is a perspective view schematically showing the sheet stickingapparatus.

FIG. 3 is an enlarged perspective view showing a front-end portion of acutting device.

FIG. 4 is an enlarged perspective view of a cutter blade and aninspection means.

FIG. 5 is a partial cross sectional view of a table and the cuttingdevice.

FIG. 6 is an explanatory view showing cutting operation of an adhesivesheet while keeping a toe-in angle.

FIG. 7 is an explanatory view showing cutting operation of an adhesivesheet while keeping a camber angle.

FIG. 8 is an explanatory view showing cutting operation of an adhesivesheet while keeping a caster angle.

FIG. 9 is an enlarged cross sectional view showing a state of cut of theadhesive sheet stuck on a wafer.

EXPLANATION OF REFERENCE NUMERALS

-   10: sheet sticking apparatus-   15: cutting device-   16: inspection means-   17: stock device-   62: robot body-   63: cutter blade-   63A: blade holder-   63B: blade-   63D: blade edge-   63E: back portion-   63F: front end portion-   63 j: base portion-   69: tool holding chuck-   L: raw strip sheet-   PS: release liner-   S: adhesive sheet-   S1: unnecessary adhesive sheet-   W: wafer (adherend)

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, embodiments of the invention will be described withreference to the drawings.

FIG. 1 is a front view schematically showing a sheet sticking apparatusto which a cutting device according to the present invention is applied;and FIG. 2 is a schematic perspective view thereof. In these figures, asheet sticking apparatus 10 comprises: a sheet feed-out unit 12 disposedin the upper portion of a base 11; a table 13 for supporting a wafer Was an adherend; a press roller 14 for imparting a press force to anadhesive sheet S fed out to the upper surface side of the wafer W tostick the adhesive sheet S to the wafer W; a cutting device 15 forcutting the adhesive sheet S along the outer edge of the wafer W aftersticking the adhesive sheet S to the wafer W; an inspection means 16(refer to FIG. 2) for inspecting a cutter blade 63 (which will bedescribed later) of the cutting device 15; a stock device 17 for storingcutter blades 63 and the like; a peeling apparatus 18 for peeling offunnecessary adhesive sheet S1 outside the wafer W from the upper surfaceof the table 13; and a winding apparatus 19 for winding the unnecessaryadhesive sheet S1.

The sheet feed-out unit 12 comprises: a support roller 20 for supportinga rolled raw strip sheet L in which a strip of adhesive sheet S istemporarily stuck on one surface of a strip of a release liner PS; apeel plate 22 with which the raw strip sheet L fed out from the supportroller 20 is sharply folded back to peel off the adhesive sheet S fromthe release liner PS; a collection roller 23 for collecting the releaseliner PS by winding the same; a plurality of guide rollers 25 to 31disposed between the support roller 20 and the collection roller 23; abuffer roller 33 disposed between the guide rollers 25 and 26; a tensionmeasuring means 35 disposed between the guide rollers 27 and 28, whichincludes a load cell 39 and a tension measuring roller 40 supported bythe load cell 39 and positioned at the base side of the peel plate 22;and a sticking-angle maintaining means 37 for integrally supporting thepeel plate 22, guide rollers 27, 28, 29, and the tension measuring means35, which interacts with the press roller 14 to maintain the stickingangle θ of the adhesive sheet S with respect to the wafer W to aconstant angle. The guide rollers 27 and 29 are provided with brakeshoes 32, 42 respectively. These brake shoes 32 and 42 are arranged soas, when sticking the adhesive sheet S to the wafer W, to be movedtoward/away from the corresponding guide rollers 27, 29, by means ofcylinders 38 and 48 respectively, to nip the adhesive sheet S torestrain the feeding thereof.

Note that the sheet feed-out unit 12, and the tension measuring means 35and the sticking-angle maintaining means 37, which constitute the sheetfeed-out unit, are the identical to those disclosed in the JapanesePatent Application Laid-Open No. 2005-198806 applied by the applicant ofthe present invention. Therefore, detailed description thereof will beomitted herein.

As shown in FIG. 5, the table 13 comprises: an outer table 51 having asubstantially square shape in plane view; and an inner table 52 having asubstantially circular shape in plane view. The outer table 51 isconfigured in a concave-shape so as to receive the inner table 52 in astate that a gap C is formed between the outer edge of the inner table52 and the outer table 51, and is arranged so as to move in the verticaldirection with respect to the base 11 via a uniaxial robot 54. On theother hand, the inner table 52 is arranged so as to move in the verticaldirection with respect to the outer table 51 via a uniaxial robot 56.Accordingly, the outer table 51 and the inner table 52 are arranged soas to move integrally in the vertical direction as well as to move inthe vertical direction independently each other. Owing to this, theouter table 51 and the inner table 52 are arranged to be adjustable to apredetermined level position corresponding to the thickness of theadhesive sheet S and the wafer W.

The press roller 14 is supported via a portal frame 57. On the uppersurface side of the portal frame 57, cylinders 59, 59 are provided. Thepress roller 14 is arranged so as to move in the vertical directionowing to the operation of these cylinders 59. As shown in FIG. 2, theportal frame 57 is arranged to be movable in the X-direction in FIG. 1via a uniaxial robot 60 and a guide rail 61.

As shown in FIGS. 3 to 5, the cutting device 15 comprises a robot body62 and a cutter blade 63 supported on the free-end side of the robotbody 62. As shown in FIG. 5, the robot body 62 includes a base section64, first to sixth arms 65A to 65F, which are disposed on the uppersurface side of the base section 64 so as to be rotatable in thedirections indicated with arrows A to F respectively, and a tool holdingchuck 69 attached to the front end side of the sixth arm 65F; i.e., onthe free-end side of the robot body 62. Each of the second, third andfifth arms 65B, 65C, 65E is provided rotatably within a Y×Z plane inFIG. 5; and each of the first, fourth and sixth arms 65A, 65D, 65F isprovided rotatably about the axis thereof. The robot body 62 in thisembodiment is controlled by NC (Numerical Control). That is, themovement amount of the respective joints with respect to a workpiece iscontrolled based on numerical information corresponding thereto, andevery movement amount thereof is controlled through a program. Thus, themethod adopted is completely different from the conventional cuttingmeans, in which the position of cutter blade has to be changed manuallywhenever the wafer size is altered. Further, in the conventional cuttingmeans, accompanying the alteration of the posture of the cutter blade(toe-in angle α1, camber angle α2, caster angle α3, which will bedescribed later), deviation of cutting diameter has to be readjustedevery time of the alteration. The robot body 62 of the embodiment canmaintain the cutting diameter precisely to a preset value no matter howthe posture of the cutter blade is altered. Furthermore, the cutterblade 63 is arranged so as to be moved to a position outside of the areaabove the table 13; i.e., a position beside the table 13 to escapetherefrom during non-cutting operation.

As shown in FIG. 3, the tool holding chuck 69 comprises a cutter bladereceiver 70 having a substantially cylindrical shape and three chuckclaws 71 disposed at positions substantially 120° away from each otherin the peripheral direction of the cutter blade receiver 70, whichdetachably holds the cutter blade 63 and a suction arm 100 to bedescribed later. Each of the chuck claws 71 has a pointed-edge portion71A, inner end of which forms an acute angle, and is arranged so as tomove forward/backward in the radial direction with respect to the centerof the cutter blade receiver 70 by pneumatic pressure.

As shown in FIG. 4, the cutter blade 63 comprises a blade holder 63Aconstituting a base portion and a blade 63B inserted into the front endof the blade holder 63A and fixed thereto. The blade holder 63A has asubstantially cylindrical shape, and at the positions substantially 120°away from each other in the peripheral direction of the circumferentialsurface thereof, grooves 72 having a length extending from the base endto an intermediate portion thereof are formed along the axial direction.The pointed-edge portions 71A of the chuck claws 71 are arranged toengage with these grooves 72, and thereby the position of the cutterblade 63 with respect to the tool holding chuck 69 is maintained to beconstant.

The blade holder 63A is equipped with a heater (not shown) and avibrating device (not shown) therein, and is arranged so as to heat theblade 63B with the heater as well as to vibrate the blade 63B with thevibrating device. As the heater, a coil heater can be exemplified; andas the vibrating device, an ultrasonic vibrating device can beexemplified.

As shown in FIG. 2 and FIG. 4, the cutter blade inspection means 16 isarranged with a camera disposed along with the cutting device 15. Thecutter blade inspection means 16 is for detecting defects of the bladeedge 63D in the cutter blade 63 or adhered state of the adhesive on theblade edge 63D. It is arranged so that, when a defect is detected orwhen the amount of the adhesive adhered to the blade exceeds anallowable range, a signal is outputted to a control device (not shown);and corresponding to the signal, the robot body 62 automaticallyreplaces the cutter blade 63 with another one stored in the stock device17.

As shown in FIG. 2, the stock device 17 includes a first stocker 17A forstoring each cutter blade 63 and a second stocker 17B for storingsuction arms 100 to suck and hold the wafer W. In this embodiment, thecutting device 15 is arranged to be used as a transfer device as well;and thus has such a versatility is provided that, when a suction arm 100is held in stead of the cutter blade, the wafer can be transferred. Notethat the suction arm 100 comprises an arm holder 100A, which is formedwith the same grooves 72 as those of the blade holder 63A, and aY-shaped arm section 100B, which is attached to the arm holder 100A andhas vacuum holes 100C communicating with a decompression device (notshown) in the front ends thereof. Other suction arms 100 are I-shapedarms having different shapes and arms for sucking different size wafers,and there is such an arrangement as suction arms for handlingsemiconductor wafers of 8 inch, 12 inch or the like can be stocked.

As shown in FIGS. 1 and 2, the peeling apparatus 18 comprises a smalldiameter roller 80 and a large diameter roller 81. A moving frame Fsupports the small diameter roller 80 and the large diameter roller 81.The moving frame F comprises a front frame F1 and a rear frame F2,relatively disposed along the Y-direction in FIG. 2, the rear frame F2being coupled with the front frame F1 via a connecting member 83. Therear frame F2 is supported by a uniaxial robot 85, while the front frameF1 is supported by the guide rail 61. Owing to this, the moving frame Fis movable in X-direction in FIG. 2. An arm member 84 supports the largediameter roller 81 as shown in FIG. 1. The arm member 84 is arranged sothat a cylinder 88 can move the large diameter roller 81 in thedirection closer to/away from the small diameter roller 80 by thecylinder 88.

The winding apparatus 19 comprises: a drive roller 90 supported by themoving frame F; and a winding roller 93, which is supported at thefree-end of the rotation arm and abutted on the circumferential surfaceof the drive roller 90 via a spring 92 to nip the unnecessary adhesivesheet S1. A drive motor M is disposed at the shaft end of the driveroller 90, and it is arranged so that, when the drive roller 90 isdriven to rotate by the motor M, the winding roller 93 follows the driveroller 90 to rotate; thereby the unnecessary adhesive sheet S1 is woundthereon. Note that as the wound amount increases, the winding roller 93shifts rightward in FIG. 1 against the force of the spring

Next, a cutting method of the adhesive sheet S in the embodiment will bedescribed with reference to FIGS. 5 to 8. Note that the sticking methodof the adhesive sheet S is the identical to that disclosed in theJapanese Patent Application Laid-Open No. 2005-198806. Therefore,description of the sheet sticking method will be omitted here.

As the initial settings, external dimensions of the wafer, a toe-inangle α1 with which the center line of the cutter blade 63 is inclinedwith respect to the cutting direction viewed from the top in the cuttingdirection as shown in FIG. 6, a camber angle α2 with which the centerline of the cutter blade 63 is inclined viewed from the front side inthe cutting direction as shown in FIG. 7, and a caster angle α3 withwhich the center line of the cutter blade 63 is inclined with respect tothe cutting direction viewed from the side in the cutting direction asshown in FIG. 8 are inputted through an inputting device (not shown).

The above angles α1 to α3 will be described again in other words withreference to the modes shown in FIGS. 6 to 8. The toe-in angle α1 is anangle in a state that the blade edge 63D of the blade 63B is closer tothe outer periphery of the wafer W than a back portion 63E; the camberangle α2 is an angle in a state that the front end portion 63F of theblade 63B is positioned at an outer side than the base portion 63J; andthe caster angle α3 is an angle in a state that the base portion 63J ofthe blade 63B precedes the front end portion 63F in the cuttingdirection.

Note that, assuming the adhesive sheet S comes to the bottom surfaceside of the wafer W, and the adhesive sheet S is cut along the outerperiphery of the wafer from the upper surface side, the camber angle isan angle in which the base portion 63J of the blade 63B is positioned atthe outer side than the front end portion 63F. Also, as for the casterangle α3, the angle formed between the blade edge 63D and the adhesivesheet S has to be simply an acute angle. Accordingly, there may be suchan inclined posture in which the base portion 63J is positioned behindthe front end portion 63F in the cutting direction.

During the operation to stick the adhesive sheet S to the wafer W, thecutting device 15 is kept in a position where the cutter blade 63escapes in a position beside the table 13. And after the adhesive sheetS is stuck onto the upper surface of the wafer W as shown in FIG. 5, therobot body 62 performs a predetermined operation so that the cutterblade 63 moves to a position above the table 13.

Then, based on the data inputted through the inputting device, movementtrack data stored in a storage of the control device (not shown) areread out, and the blade 63B cuts the adhesive sheet S along the outershape of the wafer while maintaining the toe-in angle α1, camber angleα2 and caster angle α3 (refer to FIGS. 6 to 8). Here, when the sheet Scan be hardly cut at a room temperature, the blade 63B may be heated bythe coil heater, or may be vibrated by the ultrasonic vibrating device.Owing to this, the adhesive sheet S can be cut matching with the outerperiphery of the wafer W in a state that the cutting resistance isreduced to an extremely small level.

Note that, since the sectional configuration of the periphery of thewafer W is chamfered as shown in FIG. 9, owing to the above-describedtoe-in angle α1 and camber angle α2, the adhesive sheet S can be cutclose to an intersection P of the upper surface W1 and the side endsurface W2 of the wafer W. Accordingly, outer periphery of the adhesivesheet S does not protrude out of the outer periphery of the wafer W.Therefore, when the wafer W stuck with the adhesive sheet S is subjectedto grinding processing on the rear surface thereof in the followingprocess, such a disadvantage can be prevented that a grinder catches aprotruding portion of the sheet.

When the cutting operation of the adhesive sheet S is completed, inorder to perform a temporary function as a transfer device, the cuttingdevice 15 removes cutter blade 63B from the tool holding chuck 69, andreplaces the same with the suction arm 100. At this time, the cutterblade 63B is subjected to an inspection of the blade edge 63D by theinspection means 16. Here, when damage or the amount of the adhesiveadhered on the blade edge 63D exceeding an allowable range is detected,and when the cutter blade is determined as unacceptable, in the nextcutting operation, the unacceptable cutter blade 63B is not used, and asignal is outputted to the control device (not shown) to replace thecutter blade 63B with a new one, and the unacceptable cutter blade 63Bis stored in the stock device 17.

The cutting device 15 supporting the suction arm 100 sucks the wafer Wafter completion of cutting the adhesive sheet S, and transfers the sameto the next process; and then transfers a next wafer W to be stuck withthe adhesive sheet S from a wafer stocker (not shown) to the table 13.When the wafer W has been transferred, the cutting device performs anoperation to store the suction arm 100 to the second stocker 17B, andattaches a new cutter blade 63 to the tool holding chuck 69; thus toprepare for the next cutting operation.

When the wafers W are removed from the table 13 by the cutting device15, which temporarily functions as the transfer device, the peelingdevice 16 winds the unnecessary adhesive sheet S1. Note that since thewinding operation is the identical to the operation disclosed in theJapanese Patent Application Laid-Open No. 2005-198806, detaileddescription thereof will be omitted.

Therefore, according to the embodiment as described above, such effectscan be obtained that the adhesive sheet S stuck on the wafer W can beprecisely cut along the outer periphery of the wafer, and adherendshaving various plane shapes can be handled as the sheet cutting objects.

The best arrangement and method for carrying out the present inventionhave been disclosed so far. However, the present invention is notlimited to the above.

That is, the present invention has been illustrated and described mainlyabout a specific embodiment. However, it is possible for those skilledin the art to add various modifications, if necessary, to theabove-described embodiment with respect to the shape, position and/ordisposition without departing from the technical spirit and the range ofthe object of the present invention.

For example, in the embodiment, the case where the adhesive sheet Sstuck on the wafer W is cut along the outer periphery of the wafer W hasbeen described. However, the present invention is not limited to theabove. Taking as a target an adhesive sheet temporarily stuck on a stripof release liner via an adhesive as an adherend, the adhesive sheet andthe adhesive can be cut without cutting the release liner, or therelease liner and/or adhesive sheet can be partially cut to form acutoff line without cutting the same completely.

1. A sheet cutting device to cut a sheet stuck on an adherend on asticking table, comprising: a robot body and a cutter blade supported ona free-end of the robot body, wherein said robot body is a multi-jointrobot having a plurality of joints and these joints are controlled basedon numerical information.
 2. A sheet cutting device to cut a sheet stuckon an adherend on a sticking table, comprising: a robot body disposedbeside said sticking table and a cutter blade supported on a free-endside of the robot body and arranged so as to move along a preset track,wherein said robot body includes a tool holding chuck on the free-endside, and the cutter blade is detachably attached thereto via the toolholding chuck.
 3. The sheet cutting device according to claim 1, whereinsaid cutter blade incorporates a heater therein.
 4. The sheet cuttingdevice according to claim 1, wherein said cutter blade is arranged so asto vibrate via a vibrating device.
 5. The sheet cutting device accordingto claim 1, wherein said robot body supports said cutter blade so as toadjust the posture of the cutter blade when cutting the sheet along theouter periphery of said adherend.
 6. The sheet cutting device accordingto claim 5, wherein a posture of the cutter blade in said sheet cuttingoperation maintains a toe-in angle with which the center line of thecutter blade is inclined with respect to the cutting direction viewedfrom the top in the cutting direction, and a blade edge of the cutterblade is positioned closer to the outer periphery of the adherend thanthe back portion of the cutter blade.
 7. The sheet cutting deviceaccording to claim 5, wherein the posture of the cutter blade in saidsheet cutting operation maintains a camber angle with which the centerline of the cutter blade is inclined viewed from the front in thecutting direction, and said sheet is cut with no protrusion out of theouter periphery of said adherend.
 8. The sheet cutting device accordingto claim 5, wherein the posture of the cutter blade in said sheetcutting operation maintains a caster angle with which the center line ofsaid cutter blade is inclined in the cutting direction viewed from theside in the cutting direction, and the angle formed between said sheetand the blade edge is kept at an acute angle.
 9. The sheet cuttingdevice according to claim 1, wherein an inspection means for inspectingcutter blades is disposed in the vicinity of said robot body.
 10. Asheet cutting method to cut a sheet stuck on an adherend on a stickingtable, wherein a multi-joint robot body is used, the robot having aplurality of joints controlled based on numerical information andholding a cutter blade on a free-end of the robot body in a stateenabling to adjust a posture of the cutter blade, and said sheet is cutby movement of said cutter blade along a preset track.
 11. A sheetcutting method to cut a sheet stuck on an adherend on a sticking table,wherein a cutting device is used, a robot body of which is disposedbeside said sticking table and holds a cutter blade on a free endthereof in a state enabling to adjust a posture of the cutter blade, andthe cutting device includes a cutter blade and said sheet is cut bymovement of said cutter blade along a preset track.
 12. The sheetcutting method according to claim 10, wherein the sheet is cut in astate that said cutter blade is heated.
 13. The sheet cutting methodaccording to claim 10, wherein said cutter blade cuts the sheet whilebeing vibrated.
 14. The sheet cutting method according to claim 10,wherein the cutter blade maintains a toe-in angle with which the centerline of said cutter blade is inclined with respect to the cuttingdirection viewed from the top in the cutting direction, and the sheet iscut in a state that a blade edge of the cutter blade is positionedcloser to the outer periphery of the adherend than the back portion ofthe cutter blade.
 15. The sheet cutting method according to claim 10,wherein the cutter blade maintains a camber angle with which the centerline of said cutter blade is inclined viewed from the front in thecutting direction, and said sheet is cut with no protrusion out of theouter periphery of said adherend.
 16. The sheet cutting method accordingto claim 10, wherein the cutter blade maintains a caster angle withwhich the center line of said cutter blade is inclined in the cuttingdirection viewed from the side in the cutting direction, and the sheetis cut while keeping the angle formed between said sheet and the bladeedge at an acute angle.
 17. The sheet cutting method according to claim10, wherein said sheet is an adhesive sheet temporarily stuck on a stripof release liner as an adherend via an adhesive, and the adhesive sheetand adhesive are cut without cutting said release liner.
 18. The sheetcutting method according to claim 10, wherein said sheet is an adhesivesheet temporarily stuck on a strip of release liner as an adherend viaan adhesive; and a partial cutting is made to form a cutoff line withoutcompletely cutting said release liner and/or adhesive sheet.